快报列表

Visteon and Qualcomm Technologies team up to deliver next-generation intelligent cockpit systems 2025-05-02 15:20
Infineon Technologies and Magneti Marelli jointly launch MEMS laser beam scanning system 2025-05-01 09:40
TI releases first integrated chip solution for cabin, travel and mooring 2025-04-30 09:40
Desay SV deepens its layout of intelligent vehicles 2025-04-29 19:01
Audi E5 Sportback debuts at Shanghai Auto Show 2025-04-29 19:01
SenseTime cooperates with Dongfeng Motor 2025-04-28 22:30
Unisoc and Banma Smart Driving have reached a strategic cooperation 2025-04-27 08:41
MediaTek releases Dimensity automotive cockpit platform C-X1 2025-04-27 08:31
Unisoc launches new generation smart cockpit chip platform A8880 at 2025 Shanghai Auto Show 2025-04-26 11:50
SemiDrive Technology launches X10 chip, leading the new trend of AI cockpit processors 2025-04-26 11:41
MeiG Smart and Qualcomm jointly held the 2025 Edge Intelligence Innovation Application Competition 2025-04-26 11:40
Wutong AutoLink releases TTi AI cockpit 2025-04-25 09:00
Black Sesame Intelligence and Intel jointly launch the cabin-pilot fusion platform 2025-04-24 11:31
Joyson Electronics expands new business, with smart driving and embodied intelligence becoming new highlights 2025-04-24 09:40
The new Lantu FREE is equipped with Huawei's ADS 4.0 intelligent combination 2025-04-23 17:40