Zhongyin Microelectronics completed over 100 million yuan in round B financing

On January 2, 2024, Zhongyin Microelectronics announced that it had completed a round B financing of over 100 million yuan, led by SDIC Venture Capital, and followed by old shareholders such as Zhuoyuan Capital. The financing will be used for the development of enterprise-level high-speed interface IP and chiplet products, and accelerate the rapid implementation of chiplet products and the introduction of talents.