MediaTek and TSMC cooperate to launch 3nm process chips

MediaTek and TSMC jointly announced that their first Dimensity flagship chip using TSMC’s 3nm process has been successfully taped out and is expected to be mass-produced in 2024. This cooperation will make full use of the advantages of both parties in the field of chip design and manufacturing to bring high-performance, low-power solutions to global terminal equipment. TSMC's 3nm process technology has significantly improved performance, power consumption and yield, and will bring unprecedented user experience to smartphones, tablets, smart cars and other devices.