Core semiconductor moduli packaging et probatio consilii expectatur annuum vectigal habere circiter 1.5 miliardis Yuan postquam productionem attingunt.
2024-12-23 20:08
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Post complementum nuclei semiconductoris moduli packaging et probati propositi, expectatur consequi annuum output 4.8 decies centena IGBT modulorum et 600,000 modulorum SiC MOS, annui reditus circiter 1.5 sescenti Yuan.
