Suzhou Saier Technology Co., Ltd. occupies the CSP packaging ultra-thin metal blade market

Suzhou Saier Technology Co., Ltd.'s CSP packaging: The manufacturing process of ultra-thin metal blades below 50μm is ahead of domestic and foreign competitors, occupying more than 95% of the market share. In addition, the company also provides QFN, BGA, LGA special dicing blades and other products.