AiSi Technology has achieved remarkable results in the semiconductor chip industry

Since its establishment in 2018, Jiangsu AiSi Semiconductor Technology Co., Ltd. (hereinafter referred to as AiSi Technology) has achieved remarkable results in the two fields of "design" and "packaging and testing" in the semiconductor chip industry. The company has established a packaging plant in Xuzhou, mainly producing wire bonding packaging products such as SOP/SOT, QFN, DFN, as well as high-end SIP system-level packaging and wafer-level packaging products such as WLCSP. In addition, AiSi Technology has also established a professional testing plant in Fuyang, Anhui, and has newly built a factory in Chaohu, Hefei that integrates power semiconductor devices and power integrated circuit packaging and testing, involving the packaging and testing of power devices for the third-generation semiconductor SiC.