Detailed agenda of the Glass Substrate TGV Industry Chain Summit Forum announced

The Glass Substrate TGV Industry Chain Summit Forum will focus on TGV core technology, metal circuit production, glass core substrate, TGV technology application, the application of microscopes in semiconductor advanced packaging defect detection, the application of through-glass via technology in advanced packaging, glass substrate through-hole filling technology, laser-induced deep etching technology, high-performance IPD design, development and application, multi-physics field simulation technology, high-density glass panel-level packaging and heterogeneous integration process development challenges and solutions, and deep hole coating application of PVD equipment in TGV technology.