TGV enterprises will accelerate their layout in the second half of 2024

In the second half of 2024, the layout of TGV enterprises will accelerate. As an emerging vertical interconnection technology, TGV technology has excellent electrical, thermal and mechanical properties, and has unique advantages in the fields of RF chips, high-end MEMS sensors, and high-density system integration. Many companies have begun to produce and apply products using TGV technology, including sensors, CPUs, GPUs, AI, display panels, medical devices, and advanced semiconductor packaging.