TSMC receives $84 billion in cash and loan support from the U.S., with the third wafer fab surpassing 2nm

TSMC recently announced that the US government will provide it with a total of $11.6 billion in cash subsidies and low-interest loans, equivalent to about 84 billion yuan, to support its chip manufacturing business in the United States. This funding is the largest investment approved under the Chips and Science Act. TSMC plans to build a third wafer fab in Phoenix, Arizona, with a total investment of more than 470 billion yuan.