Micron plans to launch high-performance HBM4 memory modules in 2026

Micron announced plans to launch its high-performance HBM4 memory module in 2026. This new memory module will stack up to 16 DRAM chips, each with a capacity of 32GB, and adopt a 2048-bit wide interface, designed to provide excellent performance and energy efficiency. Micron said that with its solid foundation and continued investment in mature 1β (fifth-generation 10nm technology) process technology, HBM4 will maintain its leading position in time to market and energy efficiency, with performance improved by more than 50% over HBM3E. This innovation is expected to drive the development of the automotive electronics industry and meet the growing demand for data processing.