Changdian Technology builds advanced packaging base in Shanghai Lingang New Area

Changdian Technology has invested in building a large-scale advanced packaging base in the Lingang New Area of ​​Shanghai, focusing on the production of finished automotive chips. The project covers an area of ​​more than 200 acres, with a plant area of ​​about 200,000 square meters, and is expected to be completed in early 2025. After completion, this will become the first intelligent "dark factory" production line built by Changdian Technology in China, and will become a benchmark factory for the manufacture of large-scale professional automotive electronic chip finished products in China.