Zhang Bin, CIM Director of Tianma Microelectronics, shared the practice of digital twins in semiconductor production line optimization and fault prediction

At the ESISESIS 2024 3rd China Electronic Semiconductor Digital Intelligence Summit, Zhang Bin, CIM Director of Tianma Microelectronics, shared the practice of digital twins in semiconductor production line optimization and fault prediction. He demonstrated the huge potential of digital twin technology through actual application cases of Tianma Microelectronics.