Geng Jiashen from Unigroup Cloud Technology Co., Ltd. shared the new upgrade of Unigroup Chip Cloud 3.0

At the ESISESIS 2024 3rd China Electronic Semiconductor Digital Intelligence Summit, Geng Jiashen, chief architect of chip cloud solutions at Tsinghua Unigroup Cloud Technologies Co., Ltd., shared the new upgrade of Tsinghua Chip Cloud 3.0, which will help companies build a professional design environment.