Nvidia and AMD book all of TSMC's advanced packaging capacity this year and next

It is reported that AI giants Nvidia and AMD have booked all of TSMC's CoWoS and SoIC advanced packaging capacity for this year and next year, and are fully committed to the high-performance computing market. TSMC is confident in the development prospects of AI applications and expects server AI processor revenue to more than double this year, accounting for a low-teens percentage of total revenue. It is expected that by 2028, server AI processors will account for more than 20% of TSMC's revenue.