Ningbo Xinfeng Precision Technology successfully delivered the first domestically produced 12-inch ultra-precision wafer cutting equipment

Ningbo Xinfeng Precision Technology Co., Ltd. recently announced that it has successfully delivered the first domestically produced 12-inch ultra-precision wafer ring cutting equipment. This equipment will be used in the domestic leading semiconductor production lines. Its performance is fully comparable to international mainstream benchmark products, and some indicators have even surpassed them.