Lesent completes Series A+ financing to accelerate development of high-performance MEMS sensor chips

On December 16, 2024, a well-known investment institution announced the completion of its A+ round of investment in Lesent (Suzhou) Technology Co., Ltd. (hereinafter referred to as Lesent). Since its establishment on October 26, 2022, Lesent has been committed to the research, development, production and sales of high-performance MEMS sensor chips for industrial and automotive applications. The company is headquartered in the Photonics Industrial Park of Suzhou High-tech Zone, with its R&D center located in Pudong, Shanghai, and an R&D office in Dallas, USA. The leading party of this round of investment is full of confidence in the future development of Lesent, and believes that its technical strength and market potential in the field of MEMS sensor chips are extremely competitive.