TSMC and European chip companies jointly establish ESMC

TSMC has reached an agreement with three European chip companies, Bosch, Infineon and NXP, to jointly establish the European semiconductor manufacturing company ESMC. It is expected that the investment in the wafer factory project in Dresden, Germany will exceed 10 billion euros (about 78.2 billion yuan). TSMC holds 70% of ESMC's shares, and the other three companies each hold 10%. ESMC's first wafer factory in Dresden, Germany focuses on automotive and industrial semiconductors, using 28/22nm planar CMOS and 16/12nm FinFET mature process technologies.