TSMC's CoWoS production capacity has increased significantly, and it is expected that the production capacity in Q4 this year will reach 33,000 to 35,000 pieces

According to Taiwan Economic Daily, TSMC's CoWoS advanced packaging technology has seen a significant increase in production capacity this year due to the promotion of AI chips. It is expected that by the fourth quarter of this year, its monthly production capacity will reach 33,000 to 35,000 pieces. Despite the increase in production capacity, it still cannot meet market demand, and Nvidia has begun to seek support from other packaging and testing plants.