TSMC builds third wafer fab in the US and receives $6.6 billion in subsidies

TSMC announced that it will build a third wafer fab in Arizona, USA, and received a $6.6 billion government subsidy. The wafer fab will produce chips using a 2-nanometer or more advanced process and is expected to start production in 2028, creating about 6,000 high-tech, high-paying jobs.