Cree Semiconductor accelerates the construction of SiC packaging and testing production lines

Core Semiconductor is promoting the upgrade of its third-generation semiconductor and other power device packaging and testing production lines, and launched the first phase of IGBT and SiC basic process packaging and testing production line construction projects in June. Tang Jiao, the company's production manager, said that after the project is put into production, the annual output value is expected to reach 80 million yuan, and the production capacity will increase by 25%. This year, the company's orders have been saturated, and the products are mainly delivered to customers in the Pearl River Delta region.