Bopai Semiconductor completes hundreds of millions of yuan in equity financing to expand production capacity

On March 18, Bopai Semiconductor announced the completion of hundreds of millions of yuan in equity financing, led by Tianchuang Capital and followed by Yongxin Ark. This round of financing will be used to expand Bopai Semiconductor's production capacity. Founded in 2021, Bopai Semiconductor focuses on the supply of silver sintering equipment and AMB substrates. Its silver sintering and plastic packaging equipment have been used by many downstream customers. The company's silver sintering technology in the third-generation semiconductor SiC power module has reached the world's leading level. Its core products also include active metal brazing AMB ceramic copper-clad substrates, which have been certified and tested by world-renowned SiC power semiconductor customers.