Xingan Technology focuses on the research, development and manufacturing of wide bandgap semiconductor silicon carbide (SiC) power chips and modules
Shenzhen South Circuit
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2024-12-26 04:35
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Founded in September 2020, Xingan Technology is committed to the design, development and manufacturing of wide-bandgap semiconductor silicon carbide (SiC) power chips and modules, and has established chip device production lines and module R&D centers in Jiangyin and Shenzhen respectively.
