Ningbo Xinfeng Precision Technology helps the development of semiconductor manufacturing industry and builds a better "Chinese chip"

Ningbo Xinfeng Precision Technology Co., Ltd. has successfully developed the first 12-inch fully automatic ultra-precision wafer ring cutting equipment in China, which will provide strong support for the development of the semiconductor manufacturing industry and help create a better "Chinese chip". The equipment uses advanced technology to achieve micron-level ultra-precision processing of the wafer edge, improving production efficiency and product quality.