Tianyu Semiconductor received a large amount of Series B financing to promote the 8-inch SiC epitaxial wafer project

Tianyu Semiconductor completed a round B financing of approximately RMB 1.2 billion in February 2023. The company is one of the earliest companies in China to achieve the industrialization of third-generation semiconductor SiC epitaxial wafers. In April 2022, Tianyu Semiconductor launched an 8-inch SiC epitaxial wafer project.