UMC successfully won a large order for advanced packaging of high-performance computing products from Qualcomm

According to Taiwanese media reports, UMC recently successfully won a large order for advanced packaging of Qualcomm's high-performance computing (HPC) products. This order is expected to be used in AI PCs, automotive and the hot AI server market, and even includes high-bandwidth memory (HBM) integration. This move breaks the monopoly of a few manufacturers such as TSMC, Intel and Samsung in the advanced packaging foundry market.