UMC wins large order for advanced packaging for high performance computing (HPC) from Qualcomm

UMC has made a major breakthrough in the field of advanced packaging and successfully won a large order for high-performance computing (HPC) advanced packaging from Qualcomm. This order will be applied to the AI ​​PC, automotive and AI server markets, and even includes high-bandwidth memory (HBM) integration. UMC's move not only brings new growth points to the company, but also breaks TSMC's monopoly in the advanced packaging market.