JWM Technology and SAIC SINIC signed a cooperation agreement to jointly promote the automotive chip reliability testing project

On October 16, 2024, JWM Technology (Shanghai) Co., Ltd. and Shanghai Automotive Chip Engineering Center Co., Ltd. signed a framework agreement on the automotive chip reliability testing service project. This cooperation aims to deepen the cooperative relationship between the two parties, take advantage of their respective advantages, promote the implementation of the project, and achieve mutual benefit and win-win results. JWM Technology is a company focusing on the research and development of high-performance power devices. Its products are widely used in automobiles and new energy vehicles, photovoltaic storage charging, AI servers, robots, and pan-industry.