Yongsi Electronics promotes the development of advanced packaging technology to improve product performance

According to the announcement, Yongsi Electronics' multi-dimensional heterogeneous advanced packaging technology research and industrialization project will conduct research and industrialization in multiple directions including "wafer-level reconstruction packaging technology (RWLP)", "multi-layer wiring connection technology (HCOS-OR)", "high copper pillar connection technology (HCOS-OT)", "silicon through-hole connection board interconnection technology (HCOS-SI/AI)" based on the existing wafer-level packaging technology. After the project is completed, it is expected to produce 90,000 multi-dimensional heterogeneous advanced packaging products per year.