U.S. Commerce Department imposes new export restrictions on HBM

The U.S. Department of Commerce has announced new export restrictions on high-bandwidth memory (HBM). These restrictions apply to HBM originating in the United States and foreign-origin HBM subject to the EAR (Export Administration Regulations) under the Export Administration and Foreign Direct Product Rules (FDPR). In particular, HBM2 and more advanced HBM chips such as HBM3 and HBM3e, as well as the equipment used to manufacture these HBM chips, will be prohibited from export to China.