Yicheng Technology's innovation in AI HPC heterogeneous integrated packaging

Yicheng Technology has been continuously innovating in the field of AI and high-performance computing (HPC) heterogeneous integrated packaging, and has developed fan-out panel-level packaging (FOPLP) technology to meet future needs. Compared with traditional technologies, FOPLP has a 4-6 times increase in output efficiency and a relatively low cost, making it particularly suitable for FO packaging with high I/O density. Yicheng Technology is the first domestic company to mass-produce board-level FOMCM products for high-density signal interconnection AI HPC, further demonstrating its leadership in this field.