Nvidia AI GPU products will use Intel Foveros packaging technology

Nvidia's AI GPU products, including A100, A800, A30, H100, H800, H200 and GH200, have previously used TSMC's CoWoS-S packaging process. Now, due to TSMC's insufficient CoWoS advanced packaging capacity, Nvidia may turn to Intel's Foveros packaging technology. However, this requires Nvidia to verify and confirm the performance of Foveros packaging technology because its silicon interposer process technology is different from TSMC.