Broadcom 3.5D XDSiP product details revealed

Broadcom's 3.5D XDSiP product integrates four computing chips, one I/O chip and six HBM modules manufactured by TSMC's N2 (2nm) process. Broadcom is currently developing five products using its 3.5D technology, including several products from its major customers targeting the growing AI field, and a Fujitsu Monaka processor that will use Arm ISA and TSMC's 2nm-class process technology - targeting the AI ​​and HPC fields.