Glass Substrate TGV Industry Chain Summit Forum plans to invite many companies

The companies to be invited to the Glass Substrate TGV Industry Chain Summit Forum include glass substrate companies, glass substrate companies, TGV processing companies, chip design companies, packaging companies, equipment companies and material companies. Among them, well-known companies such as BOE, Samsung, Intel, NVIDIA, Huawei, LG, and Germany's LPKF are all invited. The participation of these companies will bring rich industry experience and innovative thinking to the forum.