Kunming High-Tech Chip Co., Ltd. Completes Nearly RMB 200 Million in Series A Financing
BAIC Industrial Investment
BAIC Group
Shenzhen South Circuit
BAIC
Capital Group
Inter
invest
Internet
Yunfeng Fund
manufacture
CITIC Construction Investment
Jiangsu
car
High
Micro
power
Shenzhen Capital Group
Shenzhen
Shenzhen
dust
Dingxi
RMB
CITIC
AI
AI
car
2024-12-27 01:51
40
Kunming High-Tech Microelectronics (Jiangsu) Co., Ltd. recently completed a nearly RMB 200 million Series A financing round, with investors including Shangqi Capital, BAIC Capital, Shenzhen Capital Group, Jucheng Capital, Puhua Capital, Yunfeng Fund, Bocom International, Sanhua Hongdao, Dingxin Capital, Guoshun Investment, Kunming High-Tech Group, CITIC Construction Investment Capital, etc. Currently, Kunming High-Tech has established cooperative relationships with many car manufacturers, industrial Internet manufacturers, power grids, rail transit and other customers.
