Introduction to Kunming High-Tech New Core Co., Ltd.

The Kunshan Hi-Tech team has more than 15 years of experience in developing 1G/2.5G/5GBase-T Ethernet physical layer PHY and switch chips for data centers, enterprise networks and gateways. The company is headquartered in Kunshan, and the chip R&D team is distributed in Kunshan Hi-Tech Zone, Suzhou Industrial Park, Shanghai Zhangjiang and Singapore. It plans to set up a R&D center in Silicon Valley. The company is currently developing Ethernet PHY, gateway and TSN switching chips, targeting the automotive electronics, industrial Internet, rail transit, smart grid and smart buildings markets; providing "independent intellectual property rights, independent controllable" domestic chips for automatic & unmanned driving, China's smart manufacturing, rail transit and smart grid building industries.