Mitsubishi Electric invests 10 billion yen to build a new power semiconductor module packaging and testing plant

Mitsubishi Electric recently announced that it plans to invest approximately 10 billion yen to build a new power semiconductor module packaging and testing plant in Fukuoka City, Fukuoka Prefecture, Japan. The five-story plant has a total area of ​​25,270 square meters and is expected to start operations in October 2026. The plant will integrate Mitsubishi Electric's previously scattered packaging and testing production lines, covering the entire process from component warehousing to production and manufacturing to final delivery. The introduction of the new system will realize the automation of production management and product transportation, and improve the production efficiency of power semiconductors.