Black Sesame Intelligence signs cooperation agreement with Hong Kong Science and Technology Park to promote global development

Black Sesame Smart and Hong Kong Science and Technology Park Corporation signed a memorandum of cooperation on November 6 to jointly promote the construction of Hong Kong's technology innovation research and development center. The center aims to build a high-performance intelligent automotive computing chip platform at the automotive level. Black Sesame Smart's investment in Hong Kong is expected to reach US$100 million, and plans to expand the local R&D team to 100 people. Hong Kong Science and Technology Park Corporation will provide Black Sesame Smart with resource docking and support its listing plan.