FAW Hongqi and Black Sesame Intelligent jointly build the next-generation intelligent driving platform, which is expected to be mass-produced in 2024

FAW Hongqi and Heizhima Intelligent have reached a cooperation agreement to jointly develop an autonomous driving domain control platform based on the Huashan® II A1000L series chips, which will be applied to 80% of FAW Hongqi's models. The two models E001 and E202 jointly developed by the two parties are expected to be mass-produced in 2024.