Silan Microelectronics signed a cooperation agreement with the Xiamen Municipal Government to promote the 8-inch SiC power device chip manufacturing project
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2024-12-27 06:54
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On May 21, the Xiamen Municipal Government signed a strategic cooperation agreement with Hangzhou Silan Microelectronics, planning to build an 8-inch SiC power device chip production line in Xiamen Haicang District. The total investment of the project is 12 billion yuan, and the annual production capacity is expected to reach 720,000 pieces after completion. This is Silan Microelectronics' third important project in Xiamen, aimed at accelerating the development of key automotive semiconductor chips.
