Chenxin Technology completes B+ round of financing, providing SiC power semiconductor testing solutions

Chenxin Technology completed its B+ round of financing on November 19, with investors including SDIC Venture Capital and Ronghui Capital. The company is committed to providing testing solutions for power semiconductor IDM companies, new energy vehicle manufacturers, Tier1, and power device design and packaging companies. Its products can cover all test links of SiC, GaN and Si-based power semiconductor devices.