Zhejiang Jingneng Microelectronics Co., Ltd. launched the second phase of the automotive-grade semiconductor packaging and testing base project

The second phase of the automotive-grade semiconductor packaging and testing base project of Zhejiang Jingneng Microelectronics Co., Ltd. has officially started. The project is located in Wenling New Town Development Zone, with a total land area of ​​approximately 15,000 square meters and a total construction area of ​​approximately 34,000 square meters. The goal of the project is to build a new production building, a living service building, and an auxiliary building for the research and development, production, and sales of automotive-grade power device series products. At the same time, the first phase of the production line will also be moved to the new plant as a whole. It is expected to be completed and production will begin in 2026.