Hong Kong Science and Technology Parks signs a memorandum of understanding with J-Square Semiconductor

Hong Kong Science Park and JSF Semiconductor (Shanghai) Co., Ltd. signed a memorandum of cooperation. The two parties will set up a global R&D center focusing on third-generation semiconductors in Hong Kong Science Park and invest in the opening of Hong Kong's first SiC 8-inch advanced vertically integrated wafer factory. The total investment of the project is about HK$6.9 billion. It is expected to produce 240,000 SiC wafers annually in 2028, driving an annual output value of more than HK$11 billion and creating more than 700 jobs.