Huatian Technology invests 3 billion yuan in Pangu Semiconductor advanced packaging and testing project

Huatian Technology announced that it will invest 3 billion yuan in the Pangu Semiconductor Advanced Packaging and Testing Project in Pukou Economic Development Zone. The project is scheduled to start partial production in 2025 and will be built in two phases. The first phase will be from 2024 to 2028 and is expected to promote the development and application of board-level packaging technology. After the project reaches full production, the annual output value is expected to be no less than 900 million yuan, and the annual economic contribution is no less than 40 million yuan.