Nvidia plans to introduce GB200 super chip ahead of schedule to accelerate the development of fan-out packaging technology

In order to cope with the problem of tight production capacity of CoWoS advanced packaging, NVIDIA decided to advance the introduction of GB200 super chip from 2026 to 2025, thereby igniting the panel-level fan-out packaging business opportunities in advance. This move is expected to further promote the development of fan-out packaging technology.