Shenghe Jingwei signed an investment agreement with Jiangyin Municipal Government

On January 20, 2022, Shenghe Jingwei signed an investment agreement with the People's Government of Jiangyin City and the Management Committee of Jiangyin High-tech Industrial Development Zone on the 12-inch mid-section silicon wafer manufacturing and three-dimensional multi-chip integrated packaging project. The total investment of the project is US$1.6 billion, and the registered capital has increased to US$830 million.