BOE Huacan Optoelectronics Zhuhai Micro LED Wafer Manufacturing and Packaging Test Base Project Equipment Moving Ceremony Successfully Held

On May 20, BOE Huacan Optoelectronics held a ceremony to move in equipment for the Micro LED wafer manufacturing and packaging test base project in Zhuhai. The project has a total investment of 2 billion yuan and is expected to be completed in June 2025. It will mainly produce Micro LED wafers and pixel devices for large-size commercial displays, AR/VR head-mounted display devices and wearable devices.