The new base of TF Microelectronics (Suzhou) was completed and the Microelectronics Co., Ltd. was unveiled

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On November 19, the completion ceremony of the new base of Tongfu AMD (Suzhou) was held, and Tongfu AMD (Suzhou) Microelectronics Co., Ltd. was unveiled. Liu Xiaotao, secretary of the municipal party committee, Shi Lei, chairman of Tongfu Microelectronics Group, and Shi Mingda, honorary chairman, attended the ceremony. Tongfu Microelectronics Group specializes in integrated circuit packaging and testing and is the world's fourth largest packaging and testing company. In 2004, it cooperated with AMD to establish Tongfu AMD Semiconductor Co., Ltd. in Suzhou. The new base of Tongfu AMD (Suzhou) is another crystallization of the strong alliance between the two parties. The project is located in Jinguan Industrial Park, Suzhou Industrial Park, with a planned land area of 155 acres. It will strive to build the most advanced high-end processor packaging and testing research and development production base in China. It is expected to achieve an annual output value of about 10 billion yuan after reaching full production. Among them, the first phase of the project specializes in FCBGA high-end advanced packaging and testing, and is expected to achieve mass production in January 2025. Shi Lei said in his speech that thanks to the efficient service, problem-solving and escort of government departments at all levels in Suzhou, the project was efficiently promoted and successfully completed, and the development history of Tongfu Microelectronics Group in Suzhou has opened a new page. We will strive to become the best manufacturer of high-end processor packaging and testing business in the world, repay Suzhou's kindness with excellent performance, and work with Suzhou to create a more brilliant future. A ceremony for the first equipment to enter the factory was also held on site. Shen Mi, member of the Standing Committee of the Municipal Party Committee and Secretary of the Party Working Committee of Suzhou Industrial Park, attended the event.