Cost analysis of silicon carbide industry chain: value concentration in upstream links

In the SiC industry chain, the upstream substrate and epitaxial layer manufacturing links account for the bulk of the total device cost, reaching 47% and 23% respectively. Compared with silicon-based devices, the cost of SiC devices is more concentrated in the upstream, and the value of the mid- and downstream manufacturing and packaging links is less. This reflects the special properties of SiC materials and the complexity of the manufacturing process.