Investment direction of the third phase of the Big Fund

In addition to the equipment and materials that were the focus of the first and second phases, AI-related chips may become a new focus of the third phase of the National Big Fund. Its investment projects include manufacturing companies such as SMIC, Huahong Semiconductor, Yangtze Memory Technologies, and Ruili Integrated Circuit, packaging and testing companies such as Huatian Technology and Tongfu Microelectronics, design companies such as Unisoc, GalaxyCore, SmartSens, Zhixin Micro, and Aojie Technology, EDA companies such as Hejian Gongsoft, equipment companies such as North Huachuang and AMEC, and material companies such as Shanghai Silicon Industry.