Directio investment tertia pars magni pecuniae
AION Y
Hua Hong
Ruili Group
EDA
est
Semi
test
Tongfu Microelectronics
invest
chip
Integration
Integration
SMIC
SMIC
Unisoc
bus
bus
Micro
Fundi
Fundi
Memoria
bus
Ruili Integration
Shanghai
armorum
lis
loca
electro
mori
Memoria
Memoria
Smart
AI
AI
2024-12-27 18:11
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Praeter apparatum et materias quae in primis et secundis gradibus feruntur, collocatio directio tertiae periodi Fundi Maximi Nationalis, AI relatas chips novas focus fieri potest. Incepta eius investment includunt societates fabricandas ut SMIC, Hua Hong Semiconductor, Yangtze Memoria, et Ruili Integration, packaging et temptans societates ut Technologia Huatian, Tongfu Microelectronics, Unisoc, Geke Micro, SmartSite, et Zhixin Micro Technologia, EDA societates ut Software Industrial Hejian, societates armorum sicut Huachuang et Sinarum Septentrionalium Micro, et societates materiales ut Shanghai Industry Silicon.
